Connector Structures of Integrated Circuits

摘要

A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.

主权项

1. A package comprising:
a die having a center, wherein the die comprises:
a first metal pad, wherein in a top view of the die, the first metal pad has a first center having a first distance from the center of the die;a first metal pillar overlapping a portion of the first metal pad, with the first metal pillar being a non-solder metal pillar, wherein the first metal pillar has a second center having a second distance from the center of the die, and in a top view of the die, the first center and the second center have a connecting line perpendicular to an edge of the die;a second metal pad having a third center shifted away from the center of the die; anda second metal pillar overlapping a portion of the second metal pad, with the second metal pillar being a non-solder metal pillar, wherein the second metal pillar is electrically coupled to the second metal pad, and the second metal pillar has a fourth center shifted away from the third center, and in a top view of the die, the third center and the fourth center have a connecting line parallel to a line connecting the center of the die and a corner of the die.