| 摘要 |
A semiconductor package and a method for manufacturing the same are disclosed. The semiconductor package comprises: a semiconductor element bonded on a flexible substrate, on which signal lines are formed, to be connected with the signal lines through gold bumps or solder bumps; and a heat-radiation layer formed on the semiconductor element and a part of the upper surface of the flexible substrate adjacent to the semiconductor element. The heat-radiation layer is formed through the application and curing of a heat-radiation paint, and the heat-radiation paint comprises epichlorohydrin bisphenol-A resin, modified epoxy resin, a curing agent, a curing accelerator, and a heat-radiation filler. |
