SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can improve humidity resistance and corrosion resistance and improve heat dissipation performance and reliability without an increase in manufacturing cost.SOLUTION: A semiconductor device comprises: a wiring board 1 having a first electrode 2 and a second electrode 3 provided around the first electrode 2; and a semiconductor chip 5 having a semiconductor substrate 6, a semiconductor circuit pattern 8 having a pad 7 including a solder provided on a principal surface of the semiconductor substrate 6 and a guard ring 9 including a solder provided on the principal surface of the semiconductor substrate 6 around the semiconductor circuit pattern 8. The semiconductor chip 5 is flip chip mounted on the wiring board 1. The pad 7 is bonded to the first electrode 2. The guard ring 9 is bonded to the second electrode 3. A melting point of the solder of the pad 7 is lower than a melting point of the solder of the guard ring 9.