| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead pin with simple structure that can be mass-produced without requiring any special processing on the printed wiring board side, and can reduce occurrence of blow hole by enhancing the solder wicking when soldering.SOLUTION: A substantially cylindrical lead pin 1 being inserted into a printed wiring board is constituted to include an inserting part 11 of small diameter being inserted into a printed wiring board, and an exposed part 12 of large diameter that is exposed to the surface of the printed wiring board. The inserting part 11 includes a flat part 11b formed at a part of the outer periphery thereof, and on the surface of a step 20 formed by the inserting part 11 and the exposed part 12, a recess 22 is formed from the outer periphery of the exposed part 12 toward the flat part 11b.</p> |
