| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate processing method capable of enhancing a particle removal rate in frozen cleaning and to provide a substrate processing apparatus.SOLUTION: A liquid film covering a top face of a substrate W is formed. Then, after freezing a portion other than a peripheral part of the liquid film, a thickness of the peripheral part of the liquid film is reduced so that a difference between a thickness of the peripheral part of the liquid film and a thickness of the liquid film in a center part is reduced. Then, the peripheral part of the liquid film is frozen. Thus, a whole liquid film is frozen and a frozen film covering the top face of the substrate W is formed.</p> |
