| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for measuring the strength of a grain boundary, capable of more accurately evaluating a stress even without using a cantilever large in size and even without performing finite element analysis, etc., in consideration of a bending moment.SOLUTION: The method for measuring the strength of a grain boundary comprises the steps of: manufacturing an ultra-microscopic tensile test piece having one grain boundary in an intermediate portion by focused ion beam processing; manufacturing a both-ends fixed beam having a microscopic size from a single crystal silicon wafer; fixing a lower end portion of the ultra-microscopic tensile test piece at the middle position of the both-ends fixed beam; fixing an upper end portion of the ultra-microscopic tensile test piece to a micro sampling probe; moving the micro sampling probe to apply a tensile load to the ultra-microscopic tensile test piece; and calculating a load applied to the ultra-microscopic tensile test piece from the flexure and spring constant of the both-ends fixed beam. |
