| 发明名称 |
FAST CURE EPOXY RESIN SYSTEMS |
| 摘要 |
A fast cure epoxy resin system is provided that upon curing has a Tg no greater than 140° C. and a Phase angle below 20° at a temperature of 140° C. or below, and prepregs and mouldings based on the system. The resin formulation matches the reactivity of the resin to the amount of curative and hardener employed. |
| 申请公布号 |
US2015299407(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201314441196 |
申请日期 |
2013.12.20 |
| 申请人 |
HEXCEL COMPOSITES LIMITED |
发明人 |
Harrington Chris |
| 分类号 |
C08J5/24;B32B27/08;C08J5/04;B32B37/18;C08L63/00;C08G59/40 |
主分类号 |
C08J5/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An epoxy resin formulation containing a curative, the formulation being curable at 150° C. in no more than 150 seconds, and being curable at 120° C. in no more than 4 minutes to provide a cured resin having Tg no greater than 140° C. |
| 地址 |
Duxford GB |
