| 摘要 |
This invention provides a composition for polishing silicon wafers. Said composition, which excels at reducing haze on the surface of silicon wafers, contains abrasive grains, a silicon-wafer polishing accelerator, an amide-group-containing polymer, and water. The backbone of the amide-group-containing polymer has a structural unit (A) derived from a monomer that can be represented by general formula (1), and the average secondary-particle size of the abrasive grains is between 10 and 60 nm, inclusive. (1) |
