发明名称 |
SILVER-COATED COPPER POWDER AND CONDUCTIVE PASTE USING THE SAME |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a silver-coated copper powder that can suppress thickening of conductive paste with time when the paste is prepared without increasing the amount of coating silver.SOLUTION: A silver-coated copper powder comprises silver-coated copper powder particles having a structure where copper powder particles are coated with silver and the surface of the copper powder particles is partially exposed. The coating amount of the silver is 35 mass% or less of the content of copper. In X-ray photoelectron spectroscopy spectra obtained by measuring the surface of the silver-coated copper powder particles using an X-ray photoelectron spectroscopy apparatus (XPS), the ratio of the peak intensity of Cu(I) and Cu(0) to the peak intensity of Cu(II) is 0.02-0.60.</p> |
申请公布号 |
JP2015183291(A) |
申请公布日期 |
2015.10.22 |
申请号 |
JP20140064158 |
申请日期 |
2014.03.26 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
FUJIMOTO TAKU;WAKIMORI YASUNARI;HAYASHI TOMIO |
分类号 |
B22F1/02;B22F1/00;H01B1/00;H01B1/22;H01B5/00 |
主分类号 |
B22F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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