| 发明名称 |
MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD FOR MOUNTING THE SAME |
| 摘要 |
A multilayer ceramic capacitor may include: a ceramic body in which dielectric layers having first via holes are stacked in a thickness direction; first internal electrodes having second via holes disposed in positions corresponding to those of the first via holes and exposed to at least one side surface of the ceramic body; second internal electrodes having third via holes disposed in positions corresponding to those of the first and second via holes; a via electrode passing through the first to third via holes to thereby be exposed to upper and lower surfaces of the ceramic body, and connected to the third via holes; and a first external electrode disposed on the at least one side surface of the ceramic body to be connected to a portion of the first internal electrode exposed to the exterior of the ceramic body. |
| 申请公布号 |
US2015302991(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201414339129 |
申请日期 |
2014.07.23 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI Woo Jin |
| 分类号 |
H01G4/236;H01G4/30;H01G4/12;H01G4/005;H01G2/06 |
主分类号 |
H01G4/236 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multilayer ceramic capacitor, comprising:
a ceramic body in which dielectric layers having first via holes are stacked in a thickness direction; first internal electrodes having second via holes disposed in positions corresponding to those of the first via holes and exposed to at least one side surface of the ceramic body; second internal electrodes having third via holes disposed in positions corresponding to those of the first and second via holes; a via electrode passing through the first to third via holes to thereby be exposed to upper and lower surfaces of the ceramic body, and connected to the third via holes; and a first external electrode disposed on the at least one side surface of the ceramic body to be connected to a portion of the first internal electrode exposed to an exterior of the ceramic body. |
| 地址 |
Suwon-Si KR |
