| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a first encapsulation part which has a balanced dome shape and covers a semiconductor element thereby to achieve favorable optical characteristics.SOLUTION: In a semiconductor device, a pair of conductive patterns 10, 20 are formed on both sides of a substrate 2, a semiconductor element 4 is die-bonded to a die bonding pad 13 of one conductive pattern 10 of the pair of conductive patterns 10, 20, which has extension parts 16, 40, 41, 42 extending radially outward at equal angles, and a first encapsulation part 6 is formed on the substrate 2 so as to cover and encapsulate the semiconductor element 4. |
