| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a paste agent achieving a die attach layer excellent in the balance of thermal conductivity and temperature cycle resistance, and to provide a semiconductor device including a semiconductor element mounted on a substrate via a die attach layer obtained by heat-treating a die attach paste.SOLUTION: A die attach paste contains metal particles forming a particle coupling structure by causing the sintering through heat treatment, and an elastomer. A semiconductor device 100 includes a substrate 30, and a semiconductor element 20 mounted on the substrate 30 via a die attach layer 10 obtained by heat-treating the die attach paste.</p> |
