| 发明名称 |
Carrier and Package Having the Carrier |
| 摘要 |
A carrier is disclosed, including: a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors that are not in contact with the conductive part and penetrate the main body to connect the first surface with the second surface. Therefore, heat generated by electronic elements can be effectively dissipated outside to improve the functionality and lifetime of electronic elements. |
| 申请公布号 |
US2015305201(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201414461808 |
申请日期 |
2014.08.18 |
| 申请人 |
Viking Tech Corporation |
发明人 |
Ho Chien-Hung;Lee Chiu-Min;Kuo Chen-Shen |
| 分类号 |
H05K7/20;H01L23/34;H01L23/14 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A carrier, comprising:
a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors penetrating the main body and connected with the first and second surfaces, wherein the heat conductors are free from being in contact with the conductive part. |
| 地址 |
Hsinchu County TW |
