| 发明名称 |
Electronic System |
| 摘要 |
An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element. |
| 申请公布号 |
US2015305190(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201514690025 |
申请日期 |
2015.04.17 |
| 申请人 |
Infineon Technologies AG ;Conti Temic microelectronic GmbH |
发明人 |
Trotta Saverio;Bal Jagjit Singh;Moeller Ulrich;Samulak Andrzej;Simbuerger Werner |
| 分类号 |
H05K7/20;H01L23/66;H01L23/40;H01L23/498;H01L23/367;H01L23/373 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic system, comprising:
a carrier comprising a waveguide feeding; a semiconductor chip comprising a first surface and a second surface, and an integrated circuit, wherein the semiconductor chip is mounted to the carrier such that the first surface faces the carrier wherein the integrated circuit is connected to the waveguide feeding; and a cooling element comprising a backshort, wherein the cooling element is mounted to the carrier such that the backshort is adjacent one end of the waveguide feeding, and wherein the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element. |
| 地址 |
Neubiberg DE |
