| 主权项 |
1. A photosensitive resin composition comprising: an epoxy resin (A), a polyhydric phenol compound (B), a cationic photopolymerization initiator (C), and an epoxy group-containing silane compound (D);
wherein the epoxy resin (A) comprises an epoxy resin (a) obtained from reaction of a phenol derivative represented by the following Formula (1) and epihalohydrin: and an epoxy resin (b) represented by the following Formula (2): wherein m is an average value, representing a real number in the range from 2 to 30, R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a trifluoromethyl group, each X independently represents a hydrogen atom or a glycidyl group, and at least one of a plurality of X present is a glycidyl group; and the polyhydric phenol compound (B) comprises one or more selected from the group consisting of phenol compounds represented by the following Formulas (3) to (6): wherein p is an average value, representing a real number in the range from 1 to 10, and each R independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; wherein q is an average value, representing a real number in the range from 1 to 10; wherein z is an average value, representing a real number in the range from 1 to 10; wherein y is an average value, representing a real number in the range from 1 to 10, and R8 and R9 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. |
