发明名称 |
PRESSURE-SENSITIVE ADHESIVE MATERIAL AND THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET |
摘要 |
A pressure-sensitive adhesive material contains a monomer and/or a polymer and 55 mass % or more of thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size of primary particle based on volume of less than 10 μm and having a first particle size distribution and second thermally conductive particles having a particle size of primary particle based on volume of 10 μm or more and having a second particle size distribution. The first thermally conductive particles are contained in the thermally conductive particles at a ratio of 10 to 80 mass %. The second thermally conductive particles are contained in the thermally conductive particles at a ratio of 20 to 90 mass %. |
申请公布号 |
US2015299531(A1) |
申请公布日期 |
2015.10.22 |
申请号 |
US201314380964 |
申请日期 |
2013.01.31 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
TOJO Midori;TERADA Yoshio;FURUTA Kenji |
分类号 |
C09J133/26;C08K3/22 |
主分类号 |
C09J133/26 |
代理机构 |
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代理人 |
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主权项 |
1. A pressure-sensitive adhesive material comprising:
a monomer and/or a polymer and 55 mass % or more of thermally conductive particles, wherein the thermally conductive particles contain first thermally conductive particles having a particle size of primary particle based on volume of less than 10 μm and having a first particle size distribution and second thermally conductive particles having a particle size of primary particle based on volume of 10 μm or more and having a second particle size distribution and the first thermally conductive particles are contained in the thermally conductive particles at a ratio of 10 to 80 mass % and the second thermally conductive particles are contained in the thermally conductive particles at a ratio of 20 to 90 mass %. |
地址 |
Ibaraki-shi, Osaka JP |