发明名称 PRESSURE-SENSITIVE ADHESIVE MATERIAL AND THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET
摘要 A pressure-sensitive adhesive material contains a monomer and/or a polymer and 55 mass % or more of thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size of primary particle based on volume of less than 10 μm and having a first particle size distribution and second thermally conductive particles having a particle size of primary particle based on volume of 10 μm or more and having a second particle size distribution. The first thermally conductive particles are contained in the thermally conductive particles at a ratio of 10 to 80 mass %. The second thermally conductive particles are contained in the thermally conductive particles at a ratio of 20 to 90 mass %.
申请公布号 US2015299531(A1) 申请公布日期 2015.10.22
申请号 US201314380964 申请日期 2013.01.31
申请人 NITTO DENKO CORPORATION 发明人 TOJO Midori;TERADA Yoshio;FURUTA Kenji
分类号 C09J133/26;C08K3/22 主分类号 C09J133/26
代理机构 代理人
主权项 1. A pressure-sensitive adhesive material comprising: a monomer and/or a polymer and 55 mass % or more of thermally conductive particles, wherein the thermally conductive particles contain first thermally conductive particles having a particle size of primary particle based on volume of less than 10 μm and having a first particle size distribution and second thermally conductive particles having a particle size of primary particle based on volume of 10 μm or more and having a second particle size distribution and the first thermally conductive particles are contained in the thermally conductive particles at a ratio of 10 to 80 mass % and the second thermally conductive particles are contained in the thermally conductive particles at a ratio of 20 to 90 mass %.
地址 Ibaraki-shi, Osaka JP