SUBSTRATE PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of uniformly processing a substrate even when a process liquid and warm water are supplied to a rear face of the substrate by using a common pipeline.SOLUTION: A substrate processing apparatus comprises a cooling mechanism including a tubular member 31 which surrounds a common pipeline. A top edge of the tubular member 31 is closed by a lid member 32 having an opening 33 connected to an edge of the common pipeline 29, for supplying a liquid near a rotation center on a rear face of a semiconductor wafer 100 which rotates by being held by a spin chuck. A supply pipe 26 of cooling water supplies pure water of atmospheric temperature to inside the tubular member 31. The pure water of atmospheric temperature supplied to inside the tubular member 31 flows out from a bottom edge of the tubular member 31 after being served for cooling of the common pipeline 29.