WIRING BOARD

摘要

The wiring board according to the embodiment of the present invention includes a core substrate including a through-hole for a grounding and a through-hole for a power supply disposed adjacent to each other, and a build-up layer formed on one surface of the core substrate. The through-hole for a grounding and the through-hole for a power supply have a cross-sectional shape perpendicular to a thickness direction of the core substrate, being any one of a triangular shape, a quadrangular shape and a hexagonal shape, containing a corner portion and a side portion connecting between the corner portions. The side portions of the through-hole for a grounding and the through-hole for a power supply being mutually adjacent are disposed so as to face each other.

主权项

1. A wiring board comprising:
a core substrate including a through-hole for a grounding and a through-hole for a power supply disposed adjacent to each other; and a build-up layer formed on one surface of the core substrate,
including a build-up insulating layer having a via hole, and a build-up wiring layer formed on a surface of the build-up insulation layer and on an inner surface of the via hole, the build-up wiring layer electrically connected to the through-hole, andforming at least one semiconductor element connection pad on a surface of the build-up layer, wherein the through-hole for a grounding and the through-hole for a power supply have a cross-sectional shape perpendicular to a thickness direction of the core substrate, being any one of a triangular shape, a quadrangular shape and a hexagonal shape, containing a corner portion and a side portion connecting between the corner portions, and wherein the side portions of the through-hole for a grounding and the through-hole for a power supply being mutually adjacent are disposed so as to face each other.