| 发明名称 |
Polishing System with Front Side Pressure Control |
| 摘要 |
A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface opposite to the first surface, a carrier head to hold a substrate against the polishing pad, and a control assembly adjacent the second surface of the platen and opposite to the carrier head. The platen comprises a platen material having an adjustable rigidity. The control assembly is configured to control the rigidity of the platen material. |
| 申请公布号 |
US2015298284(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201414257619 |
申请日期 |
2014.04.21 |
| 申请人 |
Applied Materials, Inc. |
发明人 |
David Jeffrey Drue |
| 分类号 |
B24B37/04;H01F1/44;B24B29/00 |
主分类号 |
B24B37/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing apparatus, comprising:
a platen having a first surface to support a polishing pad and a second surface opposite to the first surface, the platen comprising a platen material having an adjustable rigidity; a carrier head to hold a substrate against the polishing pad; and a control assembly adjacent the second surface of the platen and opposite to the carrier head, the control assembly being configured to control the rigidity of the platen material. |
| 地址 |
Santa Clara CA US |
