LARGE BOARD ELECTRIFIED CIRCUIT AND MANUFACTURING METHOD THEREFOR

摘要

A large board electrified circuit and a manufacturing method therefor. The large board electrified circuit comprises a color film substrate and an array substrate which are oppositely arranged, a suspended ITO pattern (54) is arranged in an outer circumferential area of the color film substrate, a contact hole is arranged in an outer circumferential area of the array substrate and adjacent to an inner circumferential area of the array substrate, the contact hole is electrically connected with a wire in the inner circumferential area of the array substrate, the position of the contact hole is matched with the suspended ITO pattern (54), and an electric conductor is arranged between the contact hole and the suspended ITO pattern (54) for the purpose of current conduction. The large board electrified circuit and the manufacturing method therefor have lowered requirements for CVD equipment, facilitate a higher utilization rate of glass substrates, achieve greater benefits and reduce the occurrence ratio of electrostatic damage.