MEMS ENCAPSULATION BY MULTILAYER FILM LAMINATION

摘要

This disclosure provides systems, methods and apparatus for a laminated film enclosing an array of microelectromechanical systems (MEMS) structures(620). In one aspect, a MEMS apparatus includes a substrate (610) having a device region (610a) and an edge region (610b) surrounding the device region and an array of MEMS structures on the substrate at the device region. A protective layer is disposed over the array of MEMS structures. A laminated film (600) is disposed over the protective layer and in contact with the substrate to form a seal at the edge region, where the laminated film forms a cavity between the substrate and the laminated film at the device region. The laminated film includes a moisture barrier layer (650) facing away from the array of MEMS structures, and a desiccant layer (640) facing toward the array of MEMS structures.