| 摘要 |
<p>Chip body 130 in which a through hole or concave is formed, intermediate film 140, on one surface of which adhesive layer 150′is formed and lower film 170, on one surface of which transfer function layer 160 is formed, are prepared. Intermediate film 140 and lower film 170 are bonded together such that transfer function layer 160 is embedded in adhesive layer 150′to form a laminated body. The laminated body and chip body 130 are bonded together by thermocompression to manufacture micro-chip 100.</p> |
