发明名称 防水電子装置の製造方法
摘要 PROBLEM TO BE SOLVED: To solve the problem in which, when an electronic component attached to one case of a bathroom television needs to be soldered to a circuit board attached to the other case thereof, although it is considered that a lead wire extended from the component is lengthened to be soldered to the circuit board and then both cases are fitted, the lead wire may be lengthened longer than needed to cause the lead wire to be caught by a mating surface between both cases.SOLUTION: A method for manufacturing a waterproof electronic apparatus comprises: forming a through-hole into which a cylindrical soldering iron is to be inserted, at a position opposite to a soldering position of a circuit board in a portion of one case, in a state in which both cases are fitted; holding a lead wire in an inner face of the one case so that the lead wire strides over the through-hole; inserting the soldering iron into the through-hole from the outside in a state in which both cases are fitted, to solder the lead wire to the circuit board; and then welding both cases together and melting the circumference of the through-hole to close the through-hole.
申请公布号 JP5797057(B2) 申请公布日期 2015.10.21
申请号 JP20110179520 申请日期 2011.08.19
申请人 アール・ビー・コントロールズ株式会社 发明人 藤田 喜彦
分类号 H05K5/06 主分类号 H05K5/06
代理机构 代理人
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