| 摘要 |
Provided is a laminated module that can suppress a temperature rise accompanying heat release by semiconductor devices, allowing stable operation, even in the case of a configuration laminating semiconductor devices having a large power consumption. The laminated module (40b) is provided with: an interposer (30a); at least one first semiconductor device (11b) disposed on one side of the interposer (30a); and at least one second semiconductor device (12b) disposed on the reverse side of the interposer (30a) from the first semiconductor device (11b). The interposer (30a) has: a main body having a channel (31) through which a fluid flows; and a heat reflection layer (61a) and/or a heat radiating layer (61b) disposed at a predetermined region of the inner wall of the main body demarcating the channel (31). |
