FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND FLIP CHIP TYPE SEMICONDUCTOR DEVICE

摘要

The present invention relates to a film for a back surface of a flip chip-type semiconductor formed on a back surface of a semiconductor element which is flip chip-connected to a target body. The film for a back surface of a flip chip-type semiconductor has a light beam transmissivity of 20% or lower at a wavelength of 532 nm or 1064 nm; and a contrast of 20% or higher between a marked portion and an unmarked portion after laser marking.