发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME |
摘要 |
Disclosed are a printed circuit board capable of improving heat dissipation and strength against warping through the use of aluminum, and a method of manufacturing same. The printed circuit board may be configured to include: a core portion formed of an aluminum material; a base layer formed of an aluminum material and bonded on both side surfaces of the core portion; a bonding member interposed between the core portion and the base layer in order to bond the base layer to the core portion; a via hole formed through the core portion, the bonding member, and the base layer; a substitution layer formed to ionize a portion exposed to the surface of the base layer and the inside of the via hole; and a plate layer formed on the substitution layer and having a circuit pattern formed thereon. |
申请公布号 |
EP2934073(A1) |
申请公布日期 |
2015.10.21 |
申请号 |
EP20130862689 |
申请日期 |
2013.12.06 |
申请人 |
TYCO ELECTRONICS AMP KOREA LTD. |
发明人 |
CHOI, YANG YOON;BEAK, OK KY |
分类号 |
H05K1/09;H05K3/46;H05K7/20 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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