| 摘要 |
The present invention relates to a film cutting apparatus. The film cutting apparatus which cuts a continuously supplied film material in a predetermined length comprises: a main frame on which the film material is secured; an oscillator unit to oscillate a laser beam having a circular cross section shape; a collimator unit making the laser beam oscillate from the oscillation unit into a parallel ray; an irradiation unit to irradiate to the film material by focusing the laser beam passing through the collimator unit having a cross section of an oval shape such that a direction of a major axis of the oval is parallel to a width direction of the film material; a driving unit to shuttle the irradiation unit along a width direction of the film material wherein the laser beam is modeled to have the cross section of the oval, and the laser beam modeled and irradiated on a machined surface of the film material such that the major axis of the oval is parallel to a cut direction of the film material. As such, beam spots of the laser beam which adjoins, are overlapped to the direction of the major axis of the oval to increase an overlapping area of the beam spots; thereby increasing the overlap ratio of the beam spots. |
