| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection structure capable of further improving conduction reliability by preventing displacement between electrodes.SOLUTION: A manufacturing method of a connection structure 1 according to the invention includes steps of: placing an anisotropic conductive material layer including conductive particles 5 on a first connection target member 2 having an electrode 2b on its top surface 2a; obtaining a laminate of the first connection target member 2, the anisotropic conductive material layer, and a second connection target member 4 by laminating the second connection target member 4 having an electrode 4b on its undersurface 4a on the top surface of the anisotropic conductive material layer; temporarily crimping the laminate; and permanently crimping the temporarily crimped laminate by curing the anisotropic conductive material layer. In the manufacturing method of the connection structure 1 according to the invention, the minimum melting viscosity at 60-100°C of the anisotropic conductive material layer of the laminate before the temporary crimp is made 3000 Pas or more and at 20000 Pas or less.</p> |
