发明名称 高分子フィルムの接合方法、及び、偏光フィルムの製造方法
摘要 An object of the present invention is to provide high quality bonding of a polymer film such as a polyvinyl alcohol resin film while use of a light absorbing agent is suppressed. A method of bonding a polymer film, including contacting a surface of a polymer film with a surface of a material to be bonded, and laser welding the interface between the surface of the polymer film and the surface of the material to be bonded, wherein water is absorbed at least in the interface side of the polymer film, the interface side is irradiated with laser light, and the laser light is absorbed by the absorbed water to perform the laser welding.
申请公布号 JP5798795(B2) 申请公布日期 2015.10.21
申请号 JP20110116052 申请日期 2011.05.24
申请人 日東電工株式会社 发明人 松尾 直之;下田 麻由
分类号 G02B5/30;B29C65/16 主分类号 G02B5/30
代理机构 代理人
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