Solid-state imaging device

摘要

A solid-state imaging device includes a dielectric substrate, a solid-state imaging element disposed on the dielectric substrate, and including a photosensitive unit at a portion of a front surface thereof, an adhesive between the dielectric substrate and the solid-state imaging element, connection conductors, a sealant, and an upper package part. The solid-state imaging element includes a photosensitive unit at a portion of a front surface thereof, and is bonded to the dielectric substrate by the adhesive such that the adhesive is in contact with a portion of a rear surface of the solid-state imaging element so as to permit air flow along other portions of the rear surface of the solid-state image element. The connection conductors electrically connect the solid-state imaging element and the dielectric substrate. The upper package part is provided on the front surface of the solid-state imaging element so as to hermetically seal the photosensitive unit.

主权项

1. A solid-state imaging device comprising:
a dielectric substrate; a solid-state imaging element disposed on the dielectric substrate, and including a photosensitive unit at a portion of a front surface thereof; an adhesive between the dielectric substrate and the solid-state imaging element, the adhesive being in contact with a portion of a rear surface of the solid-state imaging element so as to permit air flow along other portions of the rear surface of the solid-state image element; connection conductors that electrically connect the solid-state imaging element and the dielectric substrate; a frame-shaped spacer disposed on the front surface of the solid-state imaging element to surround the photosensitive unit; and an optical lid that is provided on the spacer.