| 发明名称 |
Ultra-thin power transistor and synchronous buck converter having customized footprint |
| 摘要 |
A packaged power transistor device (100) having a leadframe including a flat plate (110) and a coplanar flat strip (120) spaced from the plate, the plate having a first thickness (110a) and the strip having a second thickness (120a) smaller than the first thickness, the plate and the strip having terminals (212; 121a). A field-effect power transistor chip (210) having a third thickness (210a), a first and a second contact pad on one chip side, and a third contact pad (211) on the opposite chip side, the first pad being attached to the plate, the second pad being attached to the strip, and the third pad being coplanar with the terminals. Encapsulation compound (130) filling the thickness difference between plate and strip, and spaces between chip and terminals, wherein the compound has a surface (101) coplanar with the plate surface (111) and the opposite surface (102) coplanar with the third pad (211) and the terminals (212; 212a), the distance (104) between the surfaces being equal to the sum of the first (110a) and third (210a) thicknesses. |
| 申请公布号 |
US9165865(B2) |
申请公布日期 |
2015.10.20 |
| 申请号 |
US201113082147 |
申请日期 |
2011.04.07 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Herbsommer Juan A;Lopez Osvaldo J;Noquil Jonathan A |
| 分类号 |
H01L29/78;H01L23/495;H01L23/31;H01L23/00 |
主分类号 |
H01L29/78 |
| 代理机构 |
|
代理人 |
Shaw Steven A.;Brill Charles A.;Cimino Frank D. |
| 主权项 |
1. A power transistor package comprising:
a leadframe including a flat plate and a coplanar flat strip spaced from the plate, the plate having a first thickness and the strip having a second thickness smaller than the first thickness, the plate and the strip having terminals; a field-effect power transistor chip having a third thickness, a first and a second contact pad on one chip side, and a third contact pad on the opposite chip side, the first pad being attached to the plate, the second pad being attached to the strip, and the third pad being coplanar with the terminals; and encapsulation compound filling the thickness difference between plate and strip, and spaces between chip and terminals, wherein the compound has a surface coplanar with the plate and the opposite surface coplanar with the third pad and the terminals, the distance between the surfaces being equal to the sum of the first and third thicknesses. |
| 地址 |
Dallas TX US |
