发明名称 Semiconductor device, method for manufacturing the same, power supply apparatus and high-frequency amplification unit
摘要 A semiconductor device includes a compound semiconductor multilayer structure, a fluorine-containing barrier film that covers a surface of the compound semiconductor multilayer structure, and a gate electrode that is arranged over the compound semiconductor multilayer structure with the fluorine-containing barrier film placed the gate and the compound semiconductor multilayer structure.
申请公布号 US9165851(B2) 申请公布日期 2015.10.20
申请号 US201213597557 申请日期 2012.08.29
申请人 FUJITSU LIMITED 发明人 Ozaki Shirou;Takeda Masayuki
分类号 H01L29/66;H01L23/31;H01L29/778;H01L29/417;H01L29/423;H01L29/51;H01L29/20;H01L23/29 主分类号 H01L29/66
代理机构 Kratz, Quintos & Hanson, LLP 代理人 Kratz, Quintos & Hanson, LLP
主权项 1. A semiconductor device comprising: a compound semiconductor multilayer structure; a fluorine-containing barrier film that covers a surface of the compound semiconductor multilayer structure; an insulating film placed on the fluorine-containing barrier film; and a gate electrode that is arranged over the compound semiconductor multilayer structure and placed on the insulating film with the fluorine-containing barrier film placed between the gate and the compound semiconductor multilayer structure, wherein the fluorine-containing barrier film is any one selected from the group consisting of fluorocarbon films, boron fluoride films, films having a side-chain containing fluorocarbon, films having a side-chain containing boron fluoride, films having a side-chain containing oxygen fluoride, and films having a side-chain containing nitrogen fluoride.
地址 Kawasaki JP