发明名称 |
Semiconductor device, method for manufacturing the same, power supply apparatus and high-frequency amplification unit |
摘要 |
A semiconductor device includes a compound semiconductor multilayer structure, a fluorine-containing barrier film that covers a surface of the compound semiconductor multilayer structure, and a gate electrode that is arranged over the compound semiconductor multilayer structure with the fluorine-containing barrier film placed the gate and the compound semiconductor multilayer structure. |
申请公布号 |
US9165851(B2) |
申请公布日期 |
2015.10.20 |
申请号 |
US201213597557 |
申请日期 |
2012.08.29 |
申请人 |
FUJITSU LIMITED |
发明人 |
Ozaki Shirou;Takeda Masayuki |
分类号 |
H01L29/66;H01L23/31;H01L29/778;H01L29/417;H01L29/423;H01L29/51;H01L29/20;H01L23/29 |
主分类号 |
H01L29/66 |
代理机构 |
Kratz, Quintos & Hanson, LLP |
代理人 |
Kratz, Quintos & Hanson, LLP |
主权项 |
1. A semiconductor device comprising:
a compound semiconductor multilayer structure; a fluorine-containing barrier film that covers a surface of the compound semiconductor multilayer structure; an insulating film placed on the fluorine-containing barrier film; and a gate electrode that is arranged over the compound semiconductor multilayer structure and placed on the insulating film with the fluorine-containing barrier film placed between the gate and the compound semiconductor multilayer structure, wherein the fluorine-containing barrier film is any one selected from the group consisting of fluorocarbon films, boron fluoride films, films having a side-chain containing fluorocarbon, films having a side-chain containing boron fluoride, films having a side-chain containing oxygen fluoride, and films having a side-chain containing nitrogen fluoride. |
地址 |
Kawasaki JP |