| 发明名称 | Electronic device | ||
| 摘要 | An electronic device is provided wherein the characteristics thereof are prevented from deteriorating. The electronic device (1) is provided with: a chip component (2) having an electronic element (22); a wiring board (3) on which the chip component (2) is mounted with a space therebetween, the space for containing the electronic element (22); a resin layer (4) provided from the surface of the chip component (2) to the surface of the wiring board (3) so as to surround the space; and an inorganic insulating layer (5), which is provided at the resin layer (4) and is positioned at the side of the space. Since entry of water vapor into the space can be reduced not only by means of the resin layer (4) but also by means of the inorganic insulating layer (5), the electronic device (1) having high airtight sealing performance can be provided. | ||
| 申请公布号 | US9165849(B2) | 申请公布日期 | 2015.10.20 |
| 申请号 | US201113820080 | 申请日期 | 2011.10.25 |
| 申请人 | KYOCERA Corporation | 发明人 | Hatanaka Hidefumi;Hayashi Katsura |
| 分类号 | H05K1/18;H01L23/29;H01L23/31;H03H9/10 | 主分类号 | H05K1/18 |
| 代理机构 | Procopio, Cory, Hargreaves & Savitch LLP | 代理人 | Procopio, Cory, Hargreaves & Savitch LLP |
| 主权项 | 1. An electronic device comprising: a chip component having an electronic element; a wiring board on which the chip component is mounted with a space therebetween, the space for containing the electronic element; a resin layer provided from a surface of the chip component to a surface of the wiring board so as to surround the space; and an inorganic insulating layer which is provided at the resin layer and is positioned at a side of the space, wherein the inorganic insulating layer is provided on an inner surface of the resin layer and is exposed to the space. | ||
| 地址 | Kyoto JP | ||