MEMS microphone package structure having non-planar substrate and method of manufacturing same

摘要

A MEMS microphone package structure having a non-planar substrate includes the non-planar substrate, a cover plate, and a sound wave transducer. The non-planar substrate has a carrying bottom portion and a sidewall. The carrying bottom portion has a sound hole. The cover plate covers the non-planar substrate from above and connects to the sidewall. Both the cover plate and the sidewall have a metal layer for shielding the microphone from electromagnetic interference. The sound wave transducer is located corresponding to the sound hole. Hence, the sidewall reinforces the non-planar substrate, such that the carrying bottom portion is thinned without weakening the non-planar substrate, so as to increase the capacity of a back chamber of the microphone without changing the appearance and dimensions of the package structure.

主权项

1. A method of manufacturing an MEMS microphone package structure, the method comprising the steps of: (a) providing a non-planar substrate collection formed by arranging a plurality of non-planar substrates in an array, the non-planar substrates each having a carrying bottom portion and a sidewall surrounding and connecting to a top surface of the carrying bottom portion, the sidewall having a first metal layer, and the carrying bottom portion having a sound hole; (b) mounting a sound wave transducer and an application-specific integrated circuit (ASIC) on the carrying bottom portion of each said non-planar substrate provided in step (a), wherein the sound wave transducer corresponds in position to the sound hole; and (c) providing a cover plate collection formed by arranging a plurality of cover plates in an array, connecting the cover plate collection to the non-planar substrate collection, electrically connecting the first metal layer and the second metal layer, and performing a singulation process.