发明名称 |
Method for manufacturing electromagnetic interference shielding film |
摘要 |
Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method. |
申请公布号 |
US9167735(B2) |
申请公布日期 |
2015.10.20 |
申请号 |
US201013805843 |
申请日期 |
2010.11.12 |
申请人 |
Inktec Co., Ltd. |
发明人 |
Chung Kwang Choon;Cho Hyun Nam;Yoo Myung Bong;Cho Nam-Boo;Jin Seok Pil;No Seong Hoon |
分类号 |
H05K9/00 |
主分类号 |
H05K9/00 |
代理机构 |
The Webb Law Firm |
代理人 |
The Webb Law Firm |
主权项 |
1. A method for manufacturing an electromagnetic interference (EMI) shielding film, comprising:
(a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin, and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer. |
地址 |
Ansan-si, Kyeongki-do KR |