Lead-free solder alloy for printed circuit board assemblies for high-temperature environments

摘要

A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.

主权项

1. A premelted solid lead-free wire-form solder for use in forming solder joints in an electronic system of a well logging tool, the lead-free wire-form solder having a preliminary solid alloy composition comprising:
Silver; Copper; Antimony; and Tin; wherein the solder alloy composition has a weight % of the Silver in a range of 3.5 to 7.0, a weight % of the Copper in a range of 1.0 to 4.0, and a weight % of the Antimony in a range of 1.0 to 3.0, and the remainder Tin.