| 主权项 |
1. A smart card manufacturing method comprising a dielectric carrier film, with on one side, at least one electrical contact zone and, on a second side opposite to the first one, an electronic element assembly comprising at least one electronic chip and connecting wires, the electronic chip being connected to the said at least one electrical contact zone by the connecting wires going through a first set of openings in the dielectric carrier film, the method comprises the following steps:
on the second side of the dielectric carrier film, props of metal wires are fixed on the electrical contact zone in a direction perpendicular to the plane defined by the dielectric carrier film and having a height that is greater than or at least equal to the height of the connecting wires before a protective resin is applied to form a first protective coat with thickness that is at least equal to the maximum extension of said props in a direction perpendicular to the plane defined by the said dielectric carrier film, with an area along the plane of the dielectric carrier film that is greater than the required format of the smart card, on the first protective coat, a second protective coat is applied at least on the electronic chip, with an area along the plane of the dielectric carrier film that is greater than the required format of the smart card, said second protective coat being placed on said props, the second protective coat is fixed to the first protective coat by curing the first protective coat, the assembly obtained in that way is cut to the required format. |
