ONE-COMPONENT EPOXY ADHESIVE FOR BONDING STRUCTURAL MATERIALS

摘要

The invention relates to epoxy adhesive for bonding construction materials, which includes a thermoplastic filler, having increased fracture toughness. The technical problem solved by the proposed invention is to increase the fracture toughness of epoxy adhesive after hardening. One-component epoxy adhesive for bonding structural materials contains components in the following proportions, in parts by weight: bisphenol A epoxy resin: 100; filler – polyethersulfone with particle size <100 nm: 2.5–15; dispersant – bifunctional silane containing glycidoxylgroups and trimethoxysilylgroups: 0.5–1.5; curing accelerator – boron fluoride complex with monoethylamine: 0.5–1.0; hardener – 4,4’-diaminodiphenylsulfone: 30–36; plasticiser – n-butyl glycidyl ether: 4–8.