Flexible printed circuit board, chip on film and manufacturing method

摘要

The invention discloses a flexible printed circuit board, a chip on film and a manufacturing method. The flexible printed circuit board used for hot pressing includes an insulating substrate with long edges; the insulating substrate is provided with a plurality of pins used for hot pressing; the pins of the flexible printed circuit board used for hot pressing are along the long edge of the insulating substrate; the spacing between two adjacent pins is gradually reduced from both ends to the middle. In the invention, after hot lamination, the spacing between the pins can almost keep constant and is equivalent to the expansion result of the LCD panel; thus, better electrical connection of the pins and the leads of the LCD panel can be ensured, and electrical contact is more reliable.

主权项

1. A flexible printed circuit board used for hot pressing, comprising: an insulating substrate with long edges; wherein said insulating substrate is provided with a plurality of pins used for hot pressing; the pins of said flexible printed circuit board are used for hot pressing are arranged along the long edge of the insulating substrate; spacing/distance/intervals between each two adjacent pins gradually decrease from both lateral ends to the middle along the long edge of the insulating substrate.