| 摘要 |
A method (80) entails providing (82) a structure (117), providing (100) a controller element (102, 24), and bonding (116) the controller element to an outer surface (52, 64) of the structure. The structure includes a sensor wafer (92) and a cap wafer (94) Inner surfaces (34, 36) of the wafers (92, 94) are coupled together, with sensors (30) interposed between the wafers. One wafer (94, 92) includes a substrate portion (40, 76) with bond pads (42) formed on its inner surface (34, 36). The other wafer (94, 92) conceals the substrate portion (40, 76). After bonding, methodology (80) entails forming (120) conductive elements (60) on the element (102, 24), removing (126) material sections (96, 98, 107) from the wafers to expose the bond pads, forming (130) electrical interconnects (56), applying (134) packaging material (64), and singulating (138) to produce sensor packages (20, 70). |
| 主权项 |
1. A sensor package comprising:
a sensor structure having a sensor die and a cap, said sensor die including a sensor, a first inner surface of said cap being coupled to a second inner surface of said sensor die, one of said cap and said sensor die including a substrate portion with first bond pads located on a corresponding one of said first and second inner surfaces, and a material section of the other one of said cap and sensor die being absent; a controller die having a top side and a bottom side opposing said top side, said top side including control circuitry and second bond pads, said bottom side being bonded to an outer surface of said sensor structure to form a stacked structure; a second sensor located at said top side of said controller die; and electrical interconnects attached between corresponding ones of said first bond pads and said second bond pads, said electrical interconnects being routed at least through a region where said material section is absent. |
