发明名称 Wireless device, and information processing apparatus and storage device including the wireless device
摘要 According to one embodiment, a wireless device includes a circuit board, a semiconductor chip, a nonconductive layer, and a conductive film. The semiconductor chip includes a transmitting/receiving circuit and is mounted on the circuit board. The nonconductive layer is to seal the semiconductor chip. The conductive film is to cover a surface of the nonconductive layer, the conductive film being provided with a plurality of apertures serving as radiating elements. At least one aperture of the plurality of apertures is fed with power.
申请公布号 US9166298(B2) 申请公布日期 2015.10.20
申请号 US201313940022 申请日期 2013.07.11
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 Hashimoto Koh;Tsutsumi Yukako;Ito Takayoshi;Akita Koji
分类号 H05K1/16;H01Q13/10;H01Q1/22;H01Q1/44 主分类号 H05K1/16
代理机构 Holtz, Holtz, Goodman & Chick PC 代理人 Holtz, Holtz, Goodman & Chick PC
主权项 1. A wireless device comprising: a circuit board; a semiconductor chip comprising a transmitting/receiving circuit, the semiconductor chip being mounted on the circuit board; a nonconductive layer to seal the semiconductor chip; a conductive film to cover at least a part of a surface of the nonconductive layer and a part of side surfaces of the circuit board, the conductive film being provided with a plurality of apertures serving as radiating elements, wherein at least one aperture of the plurality of apertures is fed with power; and a metal pattern which is provided on the circuit board and electrically connected to the conductive film, wherein at least one of the plurality of apertures is formed to extend through the conductive film and the metal pattern.
地址 Tokyo JP