Composite LED package and its application to light tubes

摘要

A light emitting diode package includes a first lead frame, a second lead frame and an encapsulant. The first lead frame has a die deposition area on the top thereof for disposing LED die. The second lead frame has a contacting face on the top thereof for wire bonding. The die deposition area of the first lead frame has a first adhesion area such that the encapsulant is held by the first adhesion area when enclosing the top and bottom of the first and second lead frames. The light is emitted in all directions.

主权项

1. An LED package for LED die deposition and wire bonding comprising:
a first lead frame including:
a die deposition area on the top face of the first lead frame for disposing at least one LED die, the die deposition area having a first adhesion area at the periphery of the LED die; anda first extension electrode disposed on one end of the die deposition area; a second lead frame including:
a contacting face on the top face of the second lead frame;a wire having one end bonded to the contacting face and the other end bonded to the LED die;a second extension electrode disposed on one end of the contacting face; and an encapsulant enclosing the LED die from the top to the bottom of the first and second lead frames; wherein the first adhesion area is embedded by the encapsulant, wherein the first and second lead frames are parallel, the second extension electrode and the first extension electrode are disposed on opposite sides of the LED die, and the first and second lead frames define a filler channel therebetween; wherein the encapsulant extends from the top to the bottom of the first and second lead frames by going through the filler channel; wherein the first adhesion area includes a first protrusion and a first bendable portion, one end of the first protrusion connects to the die deposition area and the other end thereof connects to the first bendable portion; wherein the first protrusion is bent and the first bendable portion is higher than the die deposition area.