| 发明名称 | Elastic wave device | ||
| 摘要 | An elastic wave device includes a resonator and an inductor. One end of the inductor is connected to the resonator, and the other end of the inductor is connected to a ground electrode or a signal electrode. The elastic wave device includes a chip and a mounting substrate. The chip includes a piezoelectric substrate and an interdigital transducer electrode provided on the piezoelectric substrate so define the resonator. The chip is mounted on the mounting substrate. The inductor is provided to the mounting substrate. A dummy electrode to which the one end side of the inductor is connected and the ground electrode or the signal electrode are provided on a surface of the mounting substrate that is opposite to the chip. | ||
| 申请公布号 | US9166556(B2) | 申请公布日期 | 2015.10.20 |
| 申请号 | US201414339578 | 申请日期 | 2014.07.24 |
| 申请人 | Murata Manufacturing Co., Ltd. | 发明人 | Tsuda Motoji |
| 分类号 | H03H9/54;H03H9/05;H03H9/25;H03H9/08;H03H9/64;H03H9/70;H03H9/72 | 主分类号 | H03H9/54 |
| 代理机构 | Keating & Bennett, LLP | 代理人 | Keating & Bennett, LLP |
| 主权项 | 1. An elastic wave device comprising: a resonator; an inductor connected at one end thereof to the resonator and connected at another end thereof to a ground electrode or a signal electrode; a chip including a piezoelectric substrate and an interdigital transducer electrode provided on the piezoelectric substrate and defining the resonator; a dummy electrode to which the one end of the inductor is connected; and a mounting substrate on which the chip is mounted and to which the inductor is provided; wherein the chip is mounted on a front surface of the mounting substrate; the ground electrode or the signal electrode are provided on a back surface of the mounting substrate that is opposite to the front surface of the mounting substrate; and the dummy electrode is provided on the back surface of the mounting substrate. | ||
| 地址 | Kyoto JP | ||