发明名称 Cooled tape frame lift and low contact shadow ring for plasma heat isolation
摘要 Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a tape frame lift assembly for a plasma processing chamber includes a capture single ring having an upper surface for supporting a tape frame of a substrate support and for cooling the tape frame. The tape frame lift assembly also includes one or more capture lift arms for moving the capture single ring to and from transfer and processing positions. The tape frame assembly also includes one or more captured lift plate portions, one captured lift plate portion corresponding to one capture lift arm, the one or more captured lift plate portions for coupling the one or more capture lift arms to the capture single ring.
申请公布号 US9165812(B2) 申请公布日期 2015.10.20
申请号 US201414219851 申请日期 2014.03.19
申请人 Applied Materials, Inc. 发明人 Ouye Alan Hiroshi
分类号 H01L21/46;H01L21/465;H01L21/683;H01L21/78 主分类号 H01L21/46
代理机构 Blakely Sokoloff Taylor Zafman LLP 代理人 Blakely Sokoloff Taylor Zafman LLP
主权项 1. A shadow ring assembly for a plasma processing chamber, the shadow ring assembly comprising: a shadow ring having an annular body and an inner opening for accommodating an etch cathode; and a tape frame lift assembly disposed below the shadow ring, the tape frame lift assembly comprising: a capture single ring having an upper surface for supporting a tape frame of a substrate support and for cooling the tape frame, wherein the capture single ring is an annular ring with an inner opening for accommodating the etch cathode, wherein during processing both the capture single ring and the shadow ring contact the tape frame of the substrate support, and wherein the upper surface of the capture single ring of the tape frame assembly comprises a plurality of channels for flowing a cooling fluid, the plurality of channels comprising one or more radial channels and one or more circumferential channels;one or more capture lift arms for moving the capture single ring to and from transfer and processing positions; andone or more captured lift plate portions, one captured lift plate portion corresponding to one capture lift arm, the one or more captured lift plate portions for coupling the one or more capture lift arms to the capture single ring.
地址 Santa Clara CA US