| 发明名称 | Fabrication method of packaging substrate | ||
| 摘要 | A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; forming a first encapsulant in the first openings; forming a second encapsulant in the second openings; and forming a surface circuit layer on the first encapsulant and the first core circuit layer. | ||
| 申请公布号 | US9165789(B2) | 申请公布日期 | 2015.10.20 |
| 申请号 | US201514643444 | 申请日期 | 2015.03.10 |
| 申请人 | Siliconware Precision Industries Co., Ltd. | 发明人 | Ho Chi-Ching;Yu Yu-Chih;Tsai Ying-Chou |
| 分类号 | H01L21/50;H01L21/48;H01L21/56 | 主分类号 | H01L21/50 |
| 代理机构 | Mintz Levin Cohn Ferris Glovsky and Popeo, P.C | 代理人 | Mintz Levin Cohn Ferris Glovsky and Popeo, P.C ;Corless Peter F.;Jensen Steven M. |
| 主权项 | 1. A fabrication method of a packaging substrate, comprising the steps of: providing a metal board having a first surface and a second surface opposite to the first surface and forming a plurality of second openings in the second surface of the metal board so as to define a second core circuit layer between the second openings, wherein each of the second openings has a wide outer portion and a narrow inner portion; forming a second encapsulant in the second openings; forming a plurality of first openings in the first surface of the metal board so as to define a first core circuit layer between the first openings, wherein each of the first openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the first openings is in communication with the inner portion of a corresponding one of the second openings; forming a first encapsulant on the first surface and in the first openings and forming a plurality of openings in the first encapsulant for exposing the first core circuit layer; and forming a surface circuit layer on the first encapsulant and in the openings of the first encapsulant such that the surface circuit layer electrically connects the first core circuit layer. | ||
| 地址 | Taichung TW | ||