Method for assembling a chip on a substrate

摘要

In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.

主权项

1. A method of assembling an element on a substrate by providing a solder-forming mass, the method comprising:
forming a vertical stack of axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate; and heating the mass so as to cause the mass to pass into a liquid state enabling the mass to spread on the substrate; wherein: after the stack has been formed, the element is left free to move vertically upwards and downwards, during heating, variation in a vertical position of the element is measured, and the mass is independent from the element and the substrate.