Semiconductor package having unified semiconductor chips

摘要

A semiconductor package includes one or more semiconductor stack structures mounted on a package board. The semiconductor stack structures include sequentially stacked first to fourth semiconductor devices. Each of the first to fourth semiconductor devices includes a first unit semiconductor chip and a second unit semiconductor chip. The first unit semiconductor chip and the second unit semiconductor chip are unitary. A method for fabricating the semiconductor package includes forming pairs of unit semiconductor chips on a wafer, forming a scribe lane between the pairs of unit semiconductor chips, separating the pairs of unit semiconductor chips into semiconductor devices, each of the semiconductor devices having a corresponding one pair of unit semiconductor chips.

主权项

1. A semiconductor package, comprising:
a semiconductor stack structure mounted on a package board, wherein the semiconductor stack structure includes sequentially stacked first to fourth semiconductor devices, wherein each of the first to fourth semiconductor devices includes a first unit semiconductor chip, a second unit semiconductor chip, a scribe lane between the first unit semiconductor chip and the second unit semiconductor chip, and wherein the first unit semiconductor chip, the second unit semiconductor chip, and the scribe lane are unified at a wafer-level.