Embedded packaging with preformed vias

摘要

Microelectronic assemblies and methods of making the same are disclosed. In some embodiments, a microelectronic assembly includes a microelectronic element having edge surfaces bounding a front surface and contacts at the front surface; rigid metal posts disposed between at least one edge surface and a corresponding edge of the assembly, each metal post having a sidewall separating first and second end surfaces, the sidewalls have a root mean square (rms) surface roughness of less than about 1 micron; a encapsulation contacting at least the edge surfaces and the sidewalls; an insulation layer overlying the encapsulation; connection elements extending through the insulation layer, wherein at least some connection elements have cross sections smaller than those of the metal posts; a redistribution structure deposited on the insulation layer and electrically connecting first terminals with corresponding metal posts through the first connection elements, some metal posts electrically coupled with contacts of microelectronic element.

主权项

1. A microelectronic assembly, comprising:
a microelectronic element having a front surface, edge surfaces bounding the front surface, and contacts at the front surface, the microelectronic element having a first thickness extending in a first direction away from the front surface; substantially rigid metal posts extending in the first direction, the posts disposed between at least one of the edge surfaces and a corresponding edge of the microelectronic assembly, each metal post having a sidewall separating first and second end surfaces of such metal post from one another in the first direction, wherein the sidewalls of the metal posts have a root mean square (rms) surface roughness of less than about 1 micron; a encapsulation having a second thickness extending in the first direction between first and second surfaces of the encapsulation, the encapsulation contacting at least the edge surfaces of the microelectronic element and the sidewalls of the metal posts, wherein the metal posts extend at least partly through the second thickness, and the encapsulation electrically insulates adjacent metal posts from one another; the microelectronic assembly having first and second sides adjacent the first and second surfaces of the encapsulation, respectively, and having terminals at the first side; an insulation layer overlying the first surface of the encapsulation at the first side and having a thickness extending away from the first surface of the encapsulation, connection elements extending away from the first end surfaces of the metal posts and through the thickness of the insulation layer, the connection elements electrically connecting at least some of the first end surfaces with corresponding terminals, wherein at least some connection elements have cross sections smaller than cross sections of the metal posts; and an electrically conductive redistribution structure deposited on the first insulation layer, wherein the redistribution structure electrically connects the terminals with corresponding first end surfaces of the metal posts through at least some of the connection elements, wherein at least some of the metal posts are electrically coupled with the contacts of the microelectronic element.