Pre-molded MEMS device package having conductive column coupled to leadframe and cover

摘要

A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit separated by a gap above the MEMS device.

主权项

1. A package for a MEMS device comprising:
a lead frame including a die-bonding area; a mold body forming a cavity and an exterior surface, the mold body partially encapsulating the lead frame and having an interior window area in the cavity to expose the die-bonding area; a MEMS device mounted in the cavity; a conductive cover, the conductive cover physically coupled to the mold body and completely covering the cavity so as to form an enclosed chamber within the package; and a conductive column, the conductive column comprising a hole within the mold body and an electrically conductive material within the hole, the electrically conductive material electrically and physically coupled to the lead frame and to the conductive cover.