High-frequency circuit module

摘要

Provided is a high-frequency circuit module that has high mounting density. In a high-frequency circuit module, an RFIC that performs transmission and reception processes for high-frequency signals, a power amplifier IC that amplifies a transmission signal from the RFIC, and a duplexer that separates a transmission signal outputted from the power amplifier IC to an antenna and a reception signal that is inputted from the antenna to the RFIC are formed on the top surface thereof. The duplexer is disposed between the RFIC and the power amplifier IC.

主权项

1. A high-frequency circuit module, comprising:
a circuit substrate having laminated insulating layers and conductive layers; a high-frequency IC that performs a transmission process and a reception process for a high-frequency signal; a power amplifier IC that amplifies a transmission signal from the high-frequency IC; and a duplexer that separates a transmission signal and a reception signal, the transmission signal being outputted from the power amplifier IC toward an antenna, the reception signal being inputted from the antenna toward the high-frequency IC, wherein a wiring length of a signal line that is used for sending a transmission signal that has been amplified by the power amplifier IC to the duplexer is shorter than a signal line that is used for sending to the power amplifier IC a transmission signal that is outputted from the high-frequency IC and that has not been amplified, wherein the power amplifier IC is mounted in a peripheral portion of the circuit substrate, and wherein the circuit substrate comprises: a core layer that is thicker than other conductive layers; a terminal electrode formed in a peripheral portion on a bottom surface of the circuit substrate; a ground electrode that is formed in a region inside of an area where the terminal electrode is formed on the bottom surface of the circuit substrate; and a via conductor for heat dissipation that connects the ground electrode to the core layer.